IIT Hyderabad final-year student Edward Nathan Varghese has secured a record Rs 2.5 crore package from Dutch trading firm Optiver, the highest ever offer at the institute since its inception IIT ...

Hyderabad: In a major boost to campus hiring at the Indian Institute of Technology, Hyderabad (IITH), a final-year computer science engineering student has secured a staggering Rs 2.5 crore package ...

The University of Oklahoma’s Division of Interior Design offers a student-centered Bachelor of Interior Design program focused on excellence in education, research, and community engagement.

Overview: EMDLAB is an open-source numerical package developed in the MATLAB environment for the design and analysis of electrical machines, including motors, generators, transformers, and actuators.

Creativity has always been governed by time—not just how long it takes to bring an idea to life, but how long a creator can stay “in flow.” Every designer knows the frustration of an idea hanging in ...

Forbes contributors publish independent expert analyses and insights. Terri Williams is a journalist covering housing trends. Fall is the favorite season among adults in the U.S., according to a ...

If you have itchy feet or are considering downsizing, a tiny home on wheels could be the perfect solution. Easy on the eye, these super-cute structures are beautifully designed and packed with ...

A new townhome community called McNeil Court is coming to Greenville’s North Main neighborhood. Approximately 34 to 38 two-story luxury townhomes are planned on McNeil Court, along Ashley Avenue, ...

CHICAGO--(BUSINESS WIRE)--Hyatt Hotels Corporation (NYSE: H) announced the renaming of its Strategic Partner award to The Corry Oakes Strategic Partner Award, honoring the legacy of OTO Development’s ...

Gov. Gavin Newsom signed legislation Thursday providing $2.5 billion in funding to recovery efforts in Los Angeles County, where two massive wildfires killed 28 people and left behind a trail of ...

Abstract: The 2.5-D integrated circuit (2.5-D IC) packages, in which multiple dies or chips are integrated side-by-side on a single interposer, play a crucial role in meeting the high bandwidth and ...