An examination of coupled predictive simulations of thermoforming processes and drop-impact loading in package design. Balakrishna Haridas and Clinton A. Haynes Thermoformed packaging is widely used ...
Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...
The joint solution provides a high-speed and high-capacity cloud solution for analyzing the mechanical stresses in 2.5D/3D-IC multi-die systems, which extends product reliability Ansys Mechanical is ...
The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...
Before testing for potential reliability issues that could crop up with your next board design, familiarize yourself with the physical HALT and virtual-simulation processes. Highly Accelerated ...
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