Thermal analysis is the process of measuring how a material/device behaves at different temperatures. For many applications, especially single materials, a thermal analysis is a physical analytical ...

Next-generation wireless communication and radar systems often demand increased RF power within a smaller footprint to meet the performance and size requirements of their respective commercial and ...

The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...

Thermal, stress and electronics cooling in-design analysis empowers designers to utilize ECAD and MCAD seamlessly for multiphysics simulation of electro-mechanical systems Convergence of FEM and CFD ...

Due to an increase in required power levels and a reduction in available board space in multiple-phase voltage regulator applications, printed circuit board (PCB) trace design has become an important ...

Printed Circuit Boards (PCBs) are a fundamental part of the majority of electronics systems. They are primarily designed to mechanically support and electrically connect electronic components, and are ...

is the thermal resistance between the object and the environment. The problem is to determine whether the integrated circuit in question is reliable at high temperatures. Without a particular method ...

Cadence Design Systems has unveiled the Celsius Studio, the industry’s first complete AI thermal design and analysis solution for electronic systems. Celsius Studio has been developed to address ...

The new coating on XPG DDR5 memory is impressive, not only does the PCB thermal coating cool the memory temperatures, but it will increase the performance and lifespan of ADATA's overclocked XPG and ...

SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced Cadence® Celsius™ Studio, the industry’s first complete AI thermal design and analysis solution for ...