Samsung -Mechanics has reportedly secured a leading position in the supply chain for advanced substrates used in the Groq 3 ...
To capitalize on the demand for generative AI, Toppan Holdings (formerly Toppan Printing) reportedly plans to invest approximately JPY60 billion (US$403 million) to expand the production capacity of ...
TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...
As Samsung Electro-Mechanics expands supplies of flip chip (FC)-ball grid array (BGA), a high value-added semiconductor substrate, to global big tech corporations and profitability improves at its ...
The expansion of demand for artificial intelligence (AI) is energizing industries across the board. One of the hottest ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results