Low-Profile Package Provides Enhanced Performance and Flexibility for Mission-Critical Military and Aerospace Designs MOUNTAIN VIEW, Calif., July 7 /PRNewswire ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...