Samsung Electro-Mechanics is reportedly pouring over 1 trillion won ($662.3 million) into capital expenditure for a second ...

The expansion of demand for artificial intelligence (AI) is energizing industries across the board. One of the hottest ...

Samsung Electro-Mechanics has raised prices for its high-end flip-chip ball grid array (FC-BGA) substrates as demand from ...

(MENAFN- Meridian Market Consultants) The size of the FC BGA Substrates Market is expected to reach USD 3.7 billion by 2028, registering a CAGR of 7.3% from 2022 to 2028. The increasing demand for ...

To capitalize on the demand for generative AI, Toppan Holdings (formerly Toppan Printing) reportedly plans to invest approximately JPY60 billion (US$403 million) to expand the production capacity of ...

Gigavis is showing strong performance. It appears that the analysis predicting the establishment of a dominant position in glass substrates, such as flip-chip ball grid array (FC-BGA), is influencing ...

Jeong Cheol-dong, CEO and president of LG Innotek, vowed that his company will become a global leader in a next-generation semiconductor packaging substrate known as flip chip ball grid array (FC-BGA) ...

New York, June 13, 2023 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "IC Substrate in the Global PCB Market: Trends, Opportunities and ...

New FC-BGA Substrate unveiled in the CES 2023 1 st Significant production achieved in last year, Full-Scale Production will be possible in the 2 nd half of this this year CEO Jeong Cheol-dong ...