A recent research published in Engineering has unveiled a novel analysis-oriented stress–strain model that promises to revolutionize the way engineers understand and design with ultra-high-performance ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

Stress is becoming more critical to identify and plan for at advanced nodes and in advanced packages, where a simple mismatch can impact performance, power, and the reliability of a device throughout ...