Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

Venkat Nandivada, Manager of Technical Support at Master Bond Inc, talks to AZoM about die attach adhesives used in semiconductor assembly. Beyond their ability to form a tight bond between die and ...

In what is being described as a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimised a hybrid direct-bonding, self-assembly process that has the potential to ...

Nordson MARCH Addresses the Ways Plasma Treatment during Fan-out Wafer and Fan-out Panel-Level Semiconductor Packaging Maximizes Performance and Optimizes Costs In recent years, there has been an ...

Applied Materials has announced developments and a partnership for improving heterogeneous chip design and integration. The development is improved software modelling and simulation for die-to-wafer ...

QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...

DUBLIN--(BUSINESS WIRE)--The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to ResearchAndMarkets.com's offering. The Global Die Attach Equipment market is expected ...

Dublin, July 07, 2020 (GLOBE NEWSWIRE) -- The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to ResearchAndMarkets.com's offering. The Global Die Attach Equipment ...

Infineon Technologies AG introduced automotive qualified 100 percent lead-free power MOSFETs for TO package types. Infineon Technologies AG introduced automotive qualified 100 percent lead-free power ...

Motorola Inc.’s semiconductor products sector (SPS) today said it has developed and qualified the first wafer level burn-in and test (WLBT) process for flip-chip microprocessors. Motorola aims to ...

Shibuya-ku, Tokyo, Japan, Japan, Jul 14, 2022, 07:23 /Comserve / -- Die Attach Equipment Market size, share, growth, trends, segmentation, top key players, strategies ...