Venkat Nandivada, Manager of Technical Support at Master Bond Inc, talks to AZoM about die attach adhesives used in semiconductor assembly. Beyond their ability to form a tight bond between die and ...
QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...
Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...
Dublin, July 07, 2020 (GLOBE NEWSWIRE) -- The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to ResearchAndMarkets.com's offering. The Global Die Attach Equipment ...
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QPT Solves Major Problem of Waste Heat Removal in Power Electronics with Novel Die Attach Process
The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...
New York, Aug. 25, 2021 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Die Attach Machine Market by Type, Technique, and Application : Global Opportunity Analysis and ...
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