Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

So, you’ve probably heard about flip chip IC technology, maybe in passing or maybe you’re knee-deep in a project that needs it. It’s this pretty neat way of putting computer chips onto circuit boards.

iCometrue received enthusiastic responses following its show at SEMICON TAIWAN 2023. Some companies have expressed great interest in iCometrue's Logic Drive and Field Programmable Multi-Chip Package ...

Systemwide I/O planning is an exercise in coordinating device placement with associated pin and net assignments across the chip-package-board system to maximize system quality for the target ...

Global semiconductor company STMicroeletronics has released a Type 5 Near Field Communication (NFC) tag chip that, according to the company, provides a longer read range than other NFC tag types, as ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

SEOUL, Korea — South Korea's Samsung Electronics Co. Ltd. here announced what the company calls the world's smallest IC package for flash memory devices. Samsung rolled out a 512-Mbit, NAND-based ...