Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

In a new report from Ctee, Apple has the first production capacity out of TSMC in 2025 for its new 2nm process node, with plans to use next-generation 3D advanced packaging platform SoIC (or System on ...

Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...

Apple has begun mass production of its next-generation M5 series chips for key products such as the next-generation Mac and iPad, according to the Korean media outlet ETNEWS. The M5 lineup includes ...

Apple's imminent M5 Pro and M5 Max chips will run cooler and faster than ever before, as a year-old rumor about the way Apple Silicon chips are packaged resurfaces.

Apple makes well-received products, but something that sets it apart from other brands is its attention to detail. From tight corner radius rules and iconography to the familiar look of Apple Store ...

TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a ...