Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

SHENZHEN, GUANGDONG, CHINA, June 22, 2026 /EINPresswire.com/ -- In a rapidly evolving semiconductor landscape, GNS ...

Qnity Electronics, Inc. ("Qnity") (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced the launch of its Advanced Packaging Innovation Hub, ...

Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...

Intel has appointed former SK hynix and SK On CEO Lee Seok-hee as a senior vice president in its foundry business. Lee will ...

This achievement marks the beginning of a new era in packaging innovation, especially for 3D chip integration architectures with built-in energy sources. ITEN and A*STAR IME are actively exploring ...

SINGAPORE, Feb. 3, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place ...

Intel (INTC) stock rises as company appoints former SK Hynix CEO Seok-Hee Lee to lead advanced packaging and manufacturing at ...

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing ...

As part of the continued evolution of the Intel Foundry strategy, the company is establishing advanced packaging as a focused ...

This Collection supports and amplifies research related to SDG 7 - Affordable and Clean Energy. This Scientific Reports Collection welcomes original research on Advanced 3D packaging and integration.