More heterogeneous designs and packaging options add challenges across the supply chain, from design to manufacturing and into the field. Advanced packaging may be the best way forward for massive ...

Semiconductor Engineering sat down to discuss the impact of advanced node chips and advanced packaging on automotive reliability with Jay Rathert, senior director of strategic collaborations at KLA; ...

The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands State-of-the-art topside cooling (GTPAK™) and gull-wing ...

The world's most intricate and high-tech package is one you likely never see. It's a chip package inside a PC, server, phone, car or pretty much anything with silicon inside. Intel's advanced ...

Packaging design has become central to significant advances in the power electronics sector. More than a decade ago, the on-resistance of a packaged power MOSFET was on the order of an ohm; the ...

Alpha and Omega Semiconductor Ltd. (AOS) has introduced two advanced surface-mount package options for its high power MOSFET portfolio. Designed to meet the packaging requirements for the most ...